Thermally-Conductive
Materials
TYPICAL
APPLICATIONS
|
PRODUCTS
|
| • Heat
Sink |
• One
Component Epoxy |
| • Lid
Seal |
• B-Stage
Materials |
| • Heat
Dissipation |
• Thermal
Greases |
|
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
(cps)
5.0 rpm
|
Tg
(°C)
|
CURE
|
Thermal
Conductivity (W/m•K)
|
DA-5933-A
|
Outstanding
thermal dissipation for die attach
and high power LED
|
7,500
|
135
|
60
min @ 175°C
|
20
|
TM-6700
|
Non-bleed,
high temperature stable, high thermal
conductivity grease
|
100,000
|
--
|
--
|
4.5
|
TM-6400
|
Two-component,
1:1 by volume low viscosity potting
compound
|
40,000
|
190
|
120
min @ 180°C
|
2.0
|
TM-6205
|
Electrically-insulating,
multipurpose paste adhesive with good
viscosity stability
|
100,000
|
110
|
10
min @ 150°C
|
1.4
|
TM-6160
|
Low
viscosity, electrically insulating
adhesive for semi-conductor applications
|
7,000
|
95
|
45
min @ 125°C
|
2.0
|
|
|
|
|
|
|
