LED
Assembly
TYPICAL
APPLICATIONS
|
PRODUCTS
|
| • Excellent
Thermal Resistance |
• High
Thermally-Conductive Silver Filled |
| • Electrically-Conductive |
• Transparent,
UV Resistant |
| • UV
Resistant |
|
|
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
(cps)
5.0 rpm
|
Tg
(°C)
|
CURE
|
Electrical
Conductivity (ohm•cm)
|
DA-5933-A
|
Outstanding thermal dissipation for die attach and high power LED;
20 W/mK
|
7,500
|
135
|
60
min @ 175°C
|
9
x 10-5
|
DA-5887-H
|
Non-conductive, transparent, optically-clear material that withstands
UV and blue light
|
8,500
|
110
|
45
min @ 175°C
|
1
x 1014
|
DA-5055
|
Stencil/screen printable conductive adhesion for LED display
|
40,000
|
35
|
10
min @ 120°C
|
5
x 10-4
|
DA-5045
|
High thermal conductivity for LED attach; Rapid, low temp cure
and UV resistant; 20 W/mK
|
10,500
|
58
|
15
min at 150°C
|
8
x 10-5
|
DA-5044
|
Snap cure with good stability and low temperature cure capabilities
|
10,000
|
35
|
1
min @ 175°C
10 min @ 120°C
|
5
x 10-4
|
DA-5041
|
Snap cure for chip on board, LED and small die semiconductor applications
|
8,500
|
30
|
3
min @ 175°C
30 min @ 150°C
|
2
x 10-4
|
DA-5011
|
Non-conductive, transparent, optically-clear, snap cure, material
that withstands UV and blue light
|
8,000
|
80
|
2
min @ 120°C
|
1
x 1014
|
|
|
