Encapsulants
TYPICAL
APPLICATIONS
|
PRODUCTS
|
| • COB |
• One
Component Silicone |
|
• One Component
Epoxy |
|
|
|
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
|
Tg
|
CURE
SCHEDULE
|
Shelf
Life
|
400-30
|
Fast
curing low viscosity glob top
|
30,000
cps
|
145 °C
|
3
min at 160 °C
|
4
months @ 25 °C
|
500-98
|
UV curable C.O.B. with good adhesion to FR-4
|
6,000
cps
|
N/A
|
20
sec with UV
|
6
months @ <25 °C
|
704-78
|
Fast curing low viscosity glob top
|
25,000
cps
|
145 °C
|
3
min at 160 °C
|
4
months @ 25 °C
|
408-14
|
General
C.O.B. with high dot height
|
70,000
cps
|
142 °C
|
20
min at 160 °C
|
3
months @ 0 °C
|
EN
7826
|
High performance encapsulant with low CTE
(18 ppm)
|
95,000
cps
|
140 °C
|
30
min at 150 °C
|
6
months @ -40 °C
|
EN
7500 S
|
RT
stable C.O.B. silicone with excellent adhesion
|
28,000
cps
|
-121 °C
|
310
min at 150 °C
|
3
months @ 25 °C
|
|
|
|
|
