Electrically-Conductive
Adhesives
TYPICAL
APPLICATIONS
|
PRODUCTS
|
| • Solder
Replacement |
• Snap
cure |
| • Die
Attach Adhesive |
• Laminate
and lead frame attach |
| • Thermal
Management |
• Low
stress chemistry |
|
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
(cps) 5.0 rpm
|
Tg(°C)
|
CURE
|
Electrical
Conductivity (ohm•cm)
|
DA-5941
|
Exceptional electrical conductivity designed to replace solder
|
35,000
|
40
|
3
min at 225 °C
10 min at 175 °C
|
4
x 10-5
|
DA-5915
|
Exceptional electrical and high temperature properties
|
20,000
|
190
|
60
min at 175 °C
|
5
x 10-5
|
DA-5933-A
|
Outstanding thermal dissipation for die attach and high power LED;
20 W/mK
|
7,500
|
135
|
60
min at 175 °C
|
9
x 10-5
|
DA-5833
|
Semiconductor die attach with good MSL to laminate substrates
|
7,000
|
35
|
45
min at 175 °C
|
2
x 10-4
|
DA-5300-4
|
Die attach for leadframe applications delivering outstanding MSL
performance
|
8,000
|
30
|
45
min at 175 °C
|
9
x 10-4
|
DA-5045
|
High thermal conductivity for LED attach; Rapid, low temp cure
and UV resistant; 20 W/mK
|
10,500
|
58
|
15
min at 150°C
|
8
x 10-5
|
DA-5044
|
Snap cure with good stability and low temperature cure capabilities
|
10,000
|
35
|
1
min at 175 °C
10 min at 120 °C
|
5
x 10-4
|
DA-5041
|
Snap
cure for chip on board, LED and small die semiconductor
applications
|
8,500
|
30
|
30
min at 150 °C
|
2
x 10-4
|
