Circuit
Board Assembly
TYPICAL
APPLICATIONS
|
PRODUCTS
|
| • Potting
and Encapsulating |
• One
and Two Component Epoxy |
| • Coating |
• Heat
Sink Compounds |
| • Thermal
Management |
• UV
Conformal Coatings |
|
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
|
CURE
SCHEDULE
|
OPERATING
TEMP
|
104-25
|
Thermally conductive heat sink silicone compound with 25 sec. press
flow
|
Paste
|
N/A
|
-55
to 200°C
|
105
|
Non-silicone thermally conductive heat sink compound
|
Paste
|
N/A
|
-55
to 250°C
|
300
|
One component self leveling silicone
|
Self
leveling
|
40
Min tack free
|
-55
to 205°C
|
500-71
|
Urethane conformal coating
|
75
cps
|
10-20
Min
|
-55
to 130°C
|
500-62-2
|
UV for potting and coating
|
3,000
cps
|
5
sec UV
|
-55
to 130°C
|
503-54
|
Membrane keyboard/Flexible printed circuit film material
|
9,000
cps
|
10
Min @ 110°C
|
-55
to 130°C
|
354-18
|
B-stage
epoxy sealant that is UV resistant
|
25,000
cps
|
20
min at 180°C
|
TBD
by customer requirements
|
TM
6160
|
Thermally
conductive epoxy
|
19,000
cps
|
20
min at 150°C
|
-60
to 175°C
|
