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PRODUCT
|
DESCRIPTION
|
VISCOSITY
(cps)
5.0 rpm |
Tg
(°C)
|
CURE
|
Electrical
Conductivity (ohm•cm)
|
||||||||||||
DA-5933-A
|
Outstanding
thermal dissipation for die attach and high power LED;
20 W/mK
|
7,500
|
135
|
60
min @ 175°C
|
9
x 10-5
|
||||||||||||
DA-5887-H
|
Non-conductive,
transparent, optically-clear material that withstands
UV and blue light
|
8,500
|
110
|
45
min @ 175°C
|
1
x 1014
|
||||||||||||
DA-5055
|
Stencil/screen
printable conductive adhesion for LED display
|
40,000
|
35
|
10
min @ 120°C
|
5
x 10-4
|
||||||||||||
DA-5045
|
High
thermal conductivity for LED attach; Rapid, low temp
cure and UV resistant; 20 W/mK
|
10,500
|
58
|
15
min at 150°C
|
8
x 10-5
|
||||||||||||
DA-5044
|
Snap
cure with good stability and low temperature cure capabilities
|
10,000
|
35
|
1
min @ 175°C
10 min @ 120°C |
5
x 10-4
|
||||||||||||
DA-5041
|
Snap
cure for chip on board, LED and small die semiconductor
applications
|
8,500
|
30
|
3
min @ 175°C
30 min @ 150°C |
2
x 10-4
|
||||||||||||
DA-5011
|
Non-conductive,
transparent, optically-clear, snap cure, material that
withstands UV and blue light
|
8,000
|
80
|
2
min @ 120°C
|
1
x 1014
|
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