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PRODUCT
|
DESCRIPTION
|
VISCOSITY
(cps)
5.0 rpm |
Tg(°C)
|
CURE
|
Electrical
Conductivity (ohm•cm)
|
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DA-5941
|
Exceptional electrical conductivity designed to replace solder
|
35,000
|
40
|
3
min at 225 °C
10 min at 175 °C |
4
x 10-5
|
|||||||||||||||
DA-5915
|
Exceptional
electrical and high temperature properties
|
20,000
|
190
|
60
min at 175 °C
|
5
x 10-5
|
|||||||||||||||
DA-5933-A
|
Outstanding thermal dissipation for die attach and high power LED; 20 W/mK
|
7,500
|
135
|
60
min at 175 °C
|
9
x 10-5
|
|||||||||||||||
DA-5833
|
Semiconductor
die attach with good MSL to laminate substrates
|
7,000
|
35
|
45
min at 175 °C
|
2
x 10-4
|
|||||||||||||||
DA-5300-4
|
Die
attach for leadframe applications delivering outstanding
MSL performance
|
8,000
|
30
|
45
min at 175 °C
|
9
x 10-4
|
|||||||||||||||
DA-5045
|
High
thermal conductivity for LED attach; Rapid, low temp cure
and UV resistant; 20 W/mK
|
10,500
|
58
|
15
min at 150°C
|
8 x 10-5
|
|||||||||||||||
DA-5044
|
Snap
cure with good stability and low temperature cure capabilities
|
10,000
|
35
|
1
min at 175 °C
10 min at 120 °C |
5
x 10-4
|
|||||||||||||||
DA-5041 |
Snap
cure for chip on board, LED and small die semiconductor applications
|
8,500
|
30
|
30
min at 150 °C
|
2
x 10-4
|
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