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PRODUCT
|
DESCRIPTION
|
VISCOSITY
|
CURE
SCHEDULE
|
OPERATING
TEMP
|
||||||||||||||
104-25
|
Thermally
conductive heat sink silicone compound with 25 sec. press
flow
|
Paste
|
N/A
|
-55
to 200°C
|
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105
|
Non-silicone
thermally conductive heat sink compound
|
Paste
|
N/A
|
-55
to 250°C
|
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300
|
One
component self leveling silicone
|
Self
leveling
|
40
Min tack free
|
-55
to 205°C
|
||||||||||||||
500-71
|
Urethane
conformal coating
|
75
cps
|
10-20
Min
|
-55
to 130°C
|
||||||||||||||
500-62-2
|
UV
for potting and coating
|
3,000
cps
|
5
sec UV
|
-55
to 130°C
|
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503-54
|
Membrane
keyboard/Flexible printed circuit film material
|
9,000
cps
|
10
Min @ 110°C
|
-55
to 130°C
|
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354-18
|
B-stage
epoxy sealant that is UV resistant
|
25,000
cps
|
20
min at 180°C
|
TBD
by customer requirements
|
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TM
6160
|
Thermally
conductive epoxy
|
19,000
cps
|
20
min at 150°C
|
-60
to 175°C
|
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